Thursday, October 26, 2006
IBM improves chip cooling technology
Newly engineered gel massively increases chip cooling capability
IBM has been detailing a new chip cooling technique that could massively increase the effectiveness of future heat sinks.
The invention is a bioengineered gel that sits between the chip and heat sink and transfers heat. The gel doubles the effectiveness of current heat sink systems and could significantly reduce the costs of running a data centre or server farm.
Find Full Article Here http://www.itpro.co.uk/news/96538/ibm-improves-chip-cooling-technology.html
To read more relevant articles & News stories visit B2B Technology News & Reviews Magazine
IBM has been detailing a new chip cooling technique that could massively increase the effectiveness of future heat sinks.
The invention is a bioengineered gel that sits between the chip and heat sink and transfers heat. The gel doubles the effectiveness of current heat sink systems and could significantly reduce the costs of running a data centre or server farm.
Find Full Article Here http://www.itpro.co.uk/news/96538/ibm-improves-chip-cooling-technology.html
To read more relevant articles & News stories visit B2B Technology News & Reviews Magazine
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